According to Wccftech, Samsung has made a major breakthrough in memory technology, it plans to transfer HBM high-bandwidth memory from servers to consumer devices such as smartphones and tablets, and rely on advanced packaging technology to enhance mobile AI computing power, breaking the boundaries of high-end memory.
The traditional mobile phone DRAM memory interface is limited and the signal loss is large, which is difficult to meet the needs of high-speed transmission in the era of AI. To this end, Samsung upgraded the vertical copper column stacking process, greatly increased the length-to-width ratio of the copper column, and matched the fan-out wafer-level packaging technology to compress the volume and optimize the heat dissipation with a stepped stacking structure. The solution not only solves the problem that the micro copper cylinder is easy to break, but also improves the memory bandwidth by 30% .
Until now, HBM has been used only in servers and high-end AI chips, which are expensive to produce. Samsung is customizing its HBM solution for mobile devices to deliver ultra-high data speeds in a small body, with the aim of creating greater end-to-side AI performance. The technology is expected to ship with Samsung’s new Orion 2800 or 2900 processor.
In addition to Samsung, Apple also plans to introduce HBM technology in the iPhone, but has yet to identify the supply chain. Affected by the tight supply and demand of the industry, the price of mobile memory is high at this stage. Major mobile phone manufacturers may wait for prices to stabilize before large-scale production with HBM models. (Wangwang)